PIC18F25K40-I/MV Microchip Technology IC MCU 8BIT 32KB FLASH 28UQFN

label:
2023/11/8 168



CATALOG
PIC18F25K40-I/MV PARAMETRIC INFO
PIC18F25K40-I/MV PACKAGE INFO
PIC18F25K40-I/MV MANUFACTURING INFO
PIC18F25K40-I/MV PACKAGING INFO
PIC18F25K40-I/MV ECAD MODELS


PARAMETRIC INFO
Data Bus Width (bit) 8
Family Name PIC18
Device Core PIC
Instruction Set Architecture RISC
Maximum Clock Rate (MHz) 64
Program Memory Type Flash
Program Memory Size 32KB
RAM Size 2048B
Maximum CPU Frequency (MHz) 64
Number of Programmable I/Os 25
Number of Timers 4
ADC Channels 24
ADC Resolution (bit) 10
DAC Channels 1
Core Architecture PIC
Number of ADCs Single
DAC Resolution (bit) 5
Number of DACs Single
Interface Type I2C/SPI/USART
SPI 1
I2C 1
I2S 0
UART 0
USART 1
CAN 0
USB 0
Ethernet 0
Minimum Operating Supply Voltage (V) 2.3
Typical Operating Supply Voltage (V) 2.5|3.3|5
Maximum Operating Supply Voltage (V) 5.5
Minimum Operating Temperature (°C) -40
Maximum Operating Temperature (°C) 85
Temperature Flag Opr
Supplier Temperature Grade Industrial
Operating Supply Voltage (V) 2.5|3.3|5
Maximum Storage Temperature (°C) 150
Minimum Storage Temperature (°C) -65


PACKAGE INFO
Supplier Package UQFN EP
Basic Package Type Non-Lead-Frame SMT
Pin Count 28
Lead Shape No Lead
PCB 28
Tab N/R
Package Length (mm) 4
Package Width (mm) 4
Package Height (mm) 0.48
Package Diameter (mm) N/R
Mounting Surface Mount
Package Description Ultra Thin Quad Flat No Lead Package, Exposed Pad
Package Family Name QFN
Package Outline Link to Datasheet


MANUFACTURING INFO
MSL N/A
Maximum Reflow Temperature (°C) 260
Reflow Solder Time (Sec) 20 to 40
Number of Reflow Cycle 3
Standard J-STD-020C
Reflow Temp. Source Link to Datasheet
Maximum Wave Temperature (°C) N/R
Wave Solder Time (Sec) N/R
Lead Finish(Plating) Matte Sn annealed
Under Plating Material N/A
Terminal Base Material Cu Alloy
Number of Wave Cycles N/R


PACKAGING INFO
Packaging Tube
Quantity Of Packaging 91


ECAD MODELS


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