Produsen Bagian Nomor. : | XR2A-1801-N | Status RoHs : | Memimpin bebas / RoHS Compliant |
---|---|---|---|
Pabrikan / Merek : | Omron | Kondisi stok : | 12754 pcs Stock |
Deskripsi : | CONN IC DIP SOCKET 18POS GOLD | Kirim Dari : | Hongkong |
Lembar data : | XR2A-1801-N.pdf | Cara pengiriman : | DHL/Fedex/TNT/UPS/EMS |
Bagian No. | XR2A-1801-N |
---|---|
Pabrikan | Omron |
Deskripsi | CONN IC DIP SOCKET 18POS GOLD |
Memimpin Status Bebas / Status RoHS | Memimpin bebas / RoHS Compliant |
Jumlah yang tersedia | 12754 pcs |
Lembar data | XR2A-1801-N.pdf |
Mengetik | DIP, 0.3" (7.62mm) Row Spacing |
Penghentian Panjang Posting | 0.126" (3.20mm) |
Penghentian | Solder |
Seri | XR2 |
Pitch - Pos | 0.100" (2.54mm) |
Pitch - Kawin | 0.100" (2.54mm) |
Pengemasan | Bulk |
Nama lain | XR2A1801N |
Suhu Operasional | -55°C ~ 125°C |
Jumlah Posisi atau Pins (Grid) | 18 (2 x 9) |
mount Jenis | Through Hole |
Moisture Sensitivity Level (MSL) | 1 (Unlimited) |
Bahan mudah terbakar Penilaian | UL94 V-0 |
Manufacturer Standard Lead Time | 10 Weeks |
Status Gratis Memimpin / Status RoHS | Lead free / RoHS Compliant |
Material perumahan | Polybutylene Terephthalate (PBT), Glass Filled |
fitur | Open Frame |
Peringkat saat ini | 1A |
Hubungi Resistance | 20 mOhm |
Bahan Kontak - Pos | Beryllium Copper |
Bahan Kontak - Kawin | Beryllium Copper |
Hubungi Finish Tebal - Pos | 30.0µin (0.76µm) |
Hubungi Finish Thickness - Mating | 30.0µin (0.76µm) |
Hubungi Selesai - Pos | Gold |
Hubungi Finish - Mating | Gold |
CONN IC DIP SOCKET 14POS GOLD
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 14POS GOLD
CONN IC DIP SOCKET 16POS GOLD
CONN IC DIP SOCKET 28POS GOLD
CONN IC DIP SOCKET 20POS GOLD
CONN IC DIP SOCKET 14POS GOLD
CONN IC DIP SOCKET 24POS GOLD
CONN IC DIP SOCKET 20POS GOLD
CONN IC DIP SOCKET 24POS GOLD